株式会社 山本製作所

 

 

Business Offerings

manufacture and sale
of various producs

(High-density,
multi layer
Printed Circuit Boards)

・Computers, Large-
network servers/routers

・IC testers and
communications/
base stations

・Optical communications
/traffic systems and
building system

(Watch accessories)
・Watch dial plates
and cases

(Metalworking)
・Precision parts,dies
and industrial producs

(Processing of parts)
surface treatment /
plating, electrocasting
and manufacture /
sales of processed
parts

 

HOME»  ・PCB Division Top»  ・Products

Products

 

Yamamoto Manufacturing draws upon a wealth of technical know-how accumulated over more than half a century to bring

its customers multi-layer printed circuit boards of the highest reliability.

 

Large High-Density,Super-Multi-Layer Printed Circuit Boards

We can manufacture high-density, super-multi-layer printed circuit boards that facilitate high-speed transmission

through diverse technologies such as drilling, plating and impedance matching.

【Application examples】Supercomputers , servers , medical equipment(image processing units), communications infrastructure

equipment

 

Large High-density,Super-Multi-Layer Printed Circuit Boards
530mm×700mm

 


970mm×320mm

 

■Back-Drilling Technology

This technology eliminates any unnecessary via stubs to ensure high-speed transmission.

 

Back-drilling


Back-Driling,

 

Back-drilling

(photograph of sectional view)
Back-drilling(photograph of section view)、Back-drilling,Printed Circuit Bords

 

The boards can be drilled from both

sides.


Various depths and hole diameters are
supported.

 

■Plating Technology

Even printed circuit boards of high aspect ratio can be plated in a uniform manner.

 

plating technology,high aspect,printed circuit boards

 

Plating technology,、high aspect,PCB,printed circuit boards

 

Dual diameter
plating technology,high-aspect,printed circuit boards

t=6.3㎜ φ0.2㎜   t=8.1 φ0.57mm   t=7.0 φ0.55mm φ0.2mm t=3.2 φ0.25mm φ0.15mm
*0.5mmpitch
           
The spec of drill of small via
     
Small drill φ0.10mm   0.8mm      
   
SVH 8layer t=0.8mm
φ0.10mm
     

 

End Plating Technology

End plating, based on the metal resist method, is effective in terms of heat dissipation, noise reduction and other factors.

 

End plating technology,PCB,printed circuit boards

 

End plating technology,PCB,printed circuit boards

 

High-Density,Multi-Layer Printed Circuit Boards

Lamination technology, laser drilling technology and hole-sealing technologies using plating and ink, etc., are employed

to facilitate higher printed circuit board densities.

【Application examples】 Routers,servers,storage devices,measuring equipment,communications infrastructure

 

high-density,Multi-layer printed Circuit Boards

 

 

■Sequential Technology

Sequential technology ensures high-speed transmission and greater density. Additionally, the combination of

different materials using this technology bring cost (Example:FR4 and low-dielectric-constant materials).

 

sequential technology,lamination technology, PCB,printed circuit board

 

sequential technology,lamination technology, PCB,printed circuit board

 

sequential technology,lamination technology, PCB,printed circuit board

 

sequential technology,lamination technology, PCB,printed circuit board

Two-lamination steps   three-lamination steps

 

■Laser-Drilling Technology

Various via hole techniques are used to support high densities.

 

Skip-via,Laser-drilling
Skip-via hole

 

filled-via,laser-drilling
Filled-via hole

 

stacked-via,laser-drilling
Stacked-via hole

 

multi-layer printed circuit boards,drilling-technology,laser-drilling
Up to three layers can be pierced.

 

multi-layer printed circuit boards,drilling-technology,laser-drilling
The pad-on-via technique facilitates

high-density mounting.

 

multi-layer printed circuit boards,drilling-technology,laser-drilling
Via holes are stacked atop each other

for increased wiring density.

Stack Filled Via        
         
TH with filling        
Compounding the above technologies
enables further improvement in
assembly and wiring density.
       

 

■Hole-Sealing Technology Using Ink

 

 
We can support an electrified paste.
 

 

Tester Printed Circuit Boards

The use of high-precision processing allows us to create 0.4mm pitch patterns. We can also mass-produce printed circuit

boards partially electroplated with nickel and gold or printed circuit boards with thick electroless plating in nickel or gold.

 

 

 

■Narrow-Pitch Wiring Technology

 

Fine line (trace/space)Technology,IC tester,printed circuit boards,PCB,burn-in board

 

 

Fine line (trace/space)Technology,IC tester,printed circuit boards,PCB,burn-in board

   

 

Radiation board 

With our technology of thick-copper process, we can support the board with heat dissipation.

 
 The picture of via X-section  
Through hole via for signal
Through hole via for thermal conduction
          
 放熱基板ビア断面写真1  放熱基板ビア断面写真2 放熱基板ビア断面写真3 

 

Small/Complex-Shaped Multi-Layer Printed Circuit Boards

We can manufacture many different types of multi-layer printed circuit boards.

 

 

 

 

■Hybridization
Compositing of high Tg FR-4 material and low-dielectric-constant material lets us process products as required while

reducing material costs.

low dielectric constant materials :Rogers material,NELCO material

 

Hybrid Stackups,lamination,printed circuit board,PCB

 

 


Teflon Multilayer Board
Teflon Multilayer Board(8Layer)

We provide PCBs with high-speed signal and low transmission loss under 50GHz, which is in high frequency.

      

 

 

 


Aluminium PCB
We provide PCBs excellent in heat dissipation.

 

 

 


■Cavities
Cavities can be created for the mounting of components.

 

 

■Profile Machining
We can machine complex profiles. Jumping V-cut and jumping end machining are supported too.

 

Profile Machining,printed circuit board,PCB

 

Profile Machining,printed circuit board,PCB,Complex

 

■Impedance
Single/differential impedance controls are readily accommodated.

■ZBC Material
We can process products using ZBC material with built-in capacitor.