Yamamoto Manufacturing draws upon a wealth of technical know-how accumulated over more than half a century to bring

its customers multi-layer printed circuit boards of the highest reliability.

We can manufacture high-density, super-multi-layer printed circuit boards that facilitate high-speed transmission

through diverse technologies such as drilling, plating and impedance matching.

【Application examples】Supercomputers , servers , medical equipment（image processing units）, communications infrastructure

equipment

530mm×700mm

970mm×320mm

■Back-Drilling Technology

This technology eliminates any unnecessary via stubs to ensure high-speed transmission.

Back-drilling

Back-drilling

(photograph of sectional view)

The boards can be drilled from both

sides.

Various depths and hole diameters are
supported.

■Plating Technology

Even printed circuit boards of high aspect ratio can be plated in a uniform manner.

Dual diameter

■End Plating Technology

End plating, based on the metal resist method, is effective in terms of heat dissipation, noise reduction and other factors.

Lamination technology, laser drilling technology and hole-sealing technologies using plating and ink, etc., are employed

to facilitate higher printed circuit board densities.

【Application examples】 Routers,servers,storage devices,measuring equipment,communications infrastructure

■Sequential Technology

Sequential technology ensures high-speed transmission and greater density. Additionally, the combination of

different materials using this technology bring cost （Example：FR4 and low-dielectric-constant materials）.

■Laser-Drilling Technology

Various via hole techniques are used to support high densities.

Skip-via hole

Filled-via hole

Stacked-via hole

Up to three layers can be pierced.

The pad-on-via technique facilitates

high-density mounting.

Via holes are stacked atop each other

for increased wiring density.

■Hole-Sealing Technology Using Ink

The use of high-precision processing allows us to create 0.4mm pitch patterns. We can also mass-produce printed circuit

boards partially electroplated with nickel and gold or printed circuit boards with thick electroless plating in nickel or gold.

■Narrow-Pitch Wiring Technology

With our technology of thick-copper process, we can support the board with heat dissipation.

We can manufacture many different types of multi-layer printed circuit boards.

■Hybridization
Compositing of high Tg FR-4 material and low-dielectric-constant material lets us process products as required while

reducing material costs.

low dielectric constant materials ：Rogers material,NELCO material

■Cavities
Cavities can be created for the mounting of components.

■Profile Machining
We can machine complex profiles. Jumping V-cut and jumping end machining are supported too.

■Impedance
Single/differential impedance controls are readily accommodated.

■ZBC Material
We can process products using ZBC material with built-in capacitor.